SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Signal Integrity
High Bandwidth Memory
Reinforcement Learning
발행물
컨퍼런스
DesignCon 2020
2020
,
Statistical Signal/Power Integrity Analysis of High-Bandwidth Memory (HBM) Interposer Channel considering SSO Noise and Data Coding
2019 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
2019
Design and Measurement of a 28 GHz Glass Band Pass Filter based on Glass Interposers for 5G Applications
International Workshop on the Electromagnetic Compatibility of Integr
Fundamental Study on Influence of Intentional Electromagnetic Interference on IC Communication
ashi
Youngwoo Kim, Daisuke Fujimoto, Hikaru Nishiyama, Daehwan Lho, Hyunwook Park, Joungho Kim, and Yu-ichi Hayashi
Statistical Analysis of Simultaneous Switching Output (SSO) Impacts on Steady State Output Responses and Signal Integrity
