SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
High Bandwidth Memory
Reinforcement Learning
Signal Integrity
발행물
컨퍼런스
Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system
2017
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Power and Signal Integrity Analysis of Fan-out Wafer Level Package for Mobile Application Processor
Power/Ground Noise Coupling Comparison and Analysis in Silicon, Organic and Glass Interposers
2016
Design and Analysis of On-interposer Active Power Dsitribution Network for an Efficient Simultaneous Switching Noise
3D IC 2016
Power Distribution Network (PDN) Design and Analysis of A Single and Double-Sided High Bandwidth Memory (HBM) Interposer for 2.5D Terabyte/s Bandwidth System
IEEE International Conference on Signal and Power Integrity (SIPI 2016)
Mobile AP GPU Power Distribution Network Simulation and Analysis based on Chip Power Model
Electronic Components and Technology Conference (ECTC)
Highly-effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites
