SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
High Bandwidth Memory
Signal Integrity
Interposer Design
발행물
컨퍼런스
Seungtaek Jeong, Subin Kim, Youngwoo Kim, Shinyoung Park, Hyunwook Park, and Joungho Kim
2019
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Design and Analysis of Flexible Interconnects on an Extremely Thin Silicon Substrate for Flexible Wearable Devices
Subin Kim, Kyungjun Cho, Youngwoo Kim, Shinyoung Park, Hyunwook Park, Seungtaek Jeong and Joungho Kim
Power Integrity Analysis of Interposer-level Integrated Voltage Regulator for Next Generation High Bandwidth Memory
Kyungjun Cho, Youngwoo Kim, Junyong Park, Hyesoo Kim, Seongguk Kim, Subin Kim, Gapyeol Park, Kyungjune Son and Joungho Kim
Modeling and Analysis of Multiple Coupled Through-Silicon Vias (TSVs) for 2.5-D/3-D ICs
Asia-Pacific International Symposium on Electromagnetic compatibility
Study of Series-series Topology for Suppressing Electromagnetic Interference (EMI) for Digital TV Wireless Power Transfer (WPT) System
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
2018
Statistical Signal Integrity Analysis of High-Bandwidth Memory (HBM) Interposer Channel considering Non-linear Power/Ground Noise and SSO Noise
