SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Interposer Design
Reinforcement Learning
Electromagnetic Compatibility
발행물
컨퍼런스
Dong-Hyun Kim, Subin Kim, Junyong Park, Youngwoo Kim, Sumin Choi, Kyungjun Cho, and Joungho Kim
2018
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Bias-dependent Power Distribution Network Impedance Analysis with MOS Capacitor
Shinyoung Park, Jinwook Song, Subin Kim, Youngwoo Kim, and Joungho Kim
How to Manage TDMA Power Amplifier Switching Noise Coupling to Audio CODECs in Mobile Phones
Youngwoo Kim, Kyungjun Cho, Gapyeol Park, Shinyoung Park, Seungyoung Ahn, and Joungho Kim
Electrical Performance Analysis of Low-Cost and Ultra-Thin Glass Interposer: Advantages, Challenges and Solutions
of Low-Cost and Ultra-Thin Glass Interposer: Advantages, Challenges and Solutions
presentation_title
Signal and Power Integrity (SI/PI) Analysis of Heterogeneous Integration Using Embedded Multi-die Interconnect Bridge (EMIB) Technology for High Bandwidth Memory (HBM)
2017
