SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Signal Integrity
High Bandwidth Memory
Electromagnetic Compatibility
발행물
컨퍼런스
Proceedings of IEEE The 13th Global Symposium on Millimeter-Waves & THz (GSMM)
2021
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Feasibility Analysis of Over 20 Gb/s HDMI Signaling using Passive Connector and Cable Assembly
Proceedings of IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization
Statistical Analysis and Modeling of a High Bandwidth Memory (HBM) Interposer Channel
IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization
2020
High Bandwidth Memory (HBM) Interposer Channel
29th Conference on Electrical Performance of Electronic Packaging and Systems
Design, Simulation and Measurement of a Flexible Voltage-controlled Oscillator (VCO) Chip with Bending Radius
2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity (EMCSI)
Efficient Electromagnetic Analysis based on Side-Channel Measurement Focusing on Physical Structures