SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Reinforcement Learning
High Bandwidth Memory
Electromagnetic Compatibility
발행물
컨퍼런스
DesignCon
2019
,
Conference on Electrical Performance of Electronic Packaging and Systems
2018
Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module
Seungtaek Jeong, and Joungho Kim
Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface
Youngwoo Kim, Kyungjun Cho, Gapyeol Park, Seungtaek Jeong, and Joungho Kim
Electrical Performance Analysis of Glass Interposer Channel and Power Distribution Network
Junyong Park, Dong-Hyun Kim, Youngwoo Kim, Sumin Choi, and Joungho Kim
Eye-Diagram Estimation with Stochastic Model for 8B/10B Encoded High-Speed Channel
