SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Interposer Design
Electromagnetic Compatibility
Signal Integrity
발행물
컨퍼런스
Analysis of Power Inverter Parasitic Inductances Effect on Switching Characteristics for Accurate Electromagnetic Interference (EMI) Estimation
2017
,
presentation_title
Design and Analysis of Receiver Channels of Glass Interposer for Dual Band Wi-Fi Front End Module (FEM)
Design and Analysis of On-chip Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in Mobile AP
Hierarchical Power Distribution Network Design in Fanout Wafer Level Package based Mobile AP-GPU for Multi-Media System
Distribution Network Design in Fanout Wafer Level Package based Mobile AP-GPU for Multi-Media System
Eye-Diagram Estimation Methods for Voltage- and Probability-dependent PAM4 Signal on Stacked on Through-Silicon Vias (TSVs)
