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1
Oxygen-plasma-induced Cu2O MSM photodetector derived from metallic Cu thin film for UV sensing
Dong-Geon Lee, Asif Ali, Qiang Liu, Mi-Jin Jin, Doo-Seung Um*, Chang-Il Kim*
Phys. Scr., 2025
2
Impact of CF4 plasma etching on defect formation and material properties of Al2O3 thin films
Yu-Bin An, Da-Won Ryu, Seung-Hyun Ma, Dong-Geon Lee, Mi-Jin Jin, Doo-Seung Um*, Chang-Il Kim*
Phys. Scr., 2025
3
Interfacial Spin–Orbit-Coupling-Induced Strong Spin-to-Charge Conversion at an All-Oxide Ferromagnetic/Quasi-Two-Dimensional Electron Gas Interface
Mi-Jin Jin*, Guang Yang, Doo-Seung Um, Jacob Linder, Jason WA Robinson*
ACS Appl. Mater. Interfaces, 2025
4
Biodegradable and healable strain gauge based on Ti3C2Tx MXene-gelatin hydrogel composite for eco-friendly applications
Hyun-Gu Han, Dong-Geon Lee, Ji-Yeop Kim, Mi-Jin Jin, Seungyoung Park, Doo-Seung Um*, Chang-Il Kim*
Mater. Res. Express, 2025
5
Role of ZnO Capping Layer for Stability in Silver-nanowire-based Functional Heater Arrays
Sejin Kim, Dong-Geon Lee, Qiang Liu, Mi-Jin Jin, Bo Hou, Seungyoung Park, Ji-Yeop Kim, Doo-Seung Um*, Chang-Il Kim*
Sens. Mater., 2024
6
Diverse Texturing Characteristics Through Metal-Assisted Plasma Etching with Silver Nanowires
Dong-Geon Lee, Hyun-Seung Ryu, Mi-Jin Jin, Doo-Seung Um*, Chang-Il Kim*
Plasma Chem. Plasma Process., 2024
7
Transition of Cu film to Cu2O film through oxygen plasma treatment
Qiang Liu, Ji-Yeop Kim, Mi-Jin Jin, Doo-Seung Um*, Chang-Il Kim*
Mater. Chem. Phys., 2024
8
Nanohole texturing to improve the performance of a microscopic photodetector
Dong-Geon Lee, Kyeong-Keun Choi, Deok-kee Kim, Doo-Seung Um*, Chang-Il Kim*
Mater. Sci. Semicond. Process, 2024
9
Reducing the oxygen vacancy concentration in SrTiO3-δ thin films via an optimized O2 plasma treatment for enhancing device properties
Ji-Yeop Kim, Mi-Jin Jin, Bo Hou, Minsoo P. Kim, Doo-Seung Um*, Chang-Il Kim*
Appl. Surf. Sci., 2023
10
Etching characteristics and surface modification of InGaSnO thin films under Cl2/Ar plasma
Young-Hee Joo, Jae-Won Choi, Bo Hou, Hyuck-In Kwon, Doo-Seung Um*, Chang-Il Kim*
Plasma Sci. Technol., 2023
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