발행물
컨퍼런스
ENGE 2024
2024
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Investigation of Wet Etching for Through-Glass Vias (TGVs) Using Ammonium Bifluoride Solutions
Inhibition of Copper Corrosion using Polyethylene Glycol by added Chemical etching Solution
Electrochemical Polishing in Citric Acid Bath with Low Concentrations of Phosphoric Acid in Redistribution Layer
ISMP 2024
The Study of Copper-to-Copper direct bonding process using Current induced enhancement method
한국표면공학회 추계학술대회
Potential Difference-Induced Electrodeposition of Defect-Rich α-Cobalt Hydroxide on Porous Copper (PCu) For High-Voltage Performance of Supercapacitor