발행물
컨퍼런스
First Korea-US Workshop on Sensors and Electrochemistry
2024
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Facile Direct electrodeposition of 2-Dimensional Zinc Telluride Layer on Silicon Dioxide by Electrochemically Generated Hydrogen Telluride
Copper-to-Copper Direct Bonding Process Using Current-Induced Enhancement Method
ICSE2023International Conference on Surface Engineering (ICSE2023)
2023
Selective Deposition of Ag on Cu for Hybrid Bonding
Hydrogen Sensor by Switching Resistance Change of Palladium Phase Transition
Enhancing Cu-Cu Bonding with Electrodeposited Preferred Oriented Copper Films