발행물
컨퍼런스
2024 ECS Fall
2024
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Cu-Cu Bonding in Semiconductor Packaging: Utilizing Texture Control for Enhanced Performance
Electrochemical Synthesis of Tellurium Nanostructure on a Non-conductive Substrate by Redox Reaction of Tellurium Ions
ISOCC 21st International SoC Design Conference
Novel Interconnect Processes for Advanced Semiconductor Packaging
한국표면공학회 춘계학술대회
Influence of Reducing Agent on the Electrodeposition of Invar composition Ni-Fe Alloys
한국마이크로전자 및 패키징학회 2024년 정기학술대회
유리관통전극 (TGV) 을 위한 선택적 구리 전극 증착 방법