발행물
컨퍼런스
2023년도 한국표면공학회 춘계학술대회 및 특별강습회
2023
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Sensing mechanism by Switching Resistance Change of Palladium Phase Transition
Localized Electrochemical Deposition using Copper Pyrophosphate (Cu2P2O7) Electrolyte
The Study of Selective Cu Electroplating for Though Glass Via
ICEP 2023
Advanced Metallization for Next Generation Semiconductor Packaging Technologies
IEEE Electron Devices Technology and Manufacturing(EDTM) 2023
Selective Cu electrodeposition for Through Glass Via (TGV) by Blocking Layer