발행물
컨퍼런스
KISM, KOREAN INTERNATIONAL SEMICONDUCTOR CONFERENCE ON MANUFACTURING TECHNOLOGY 2022
2022
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Ruthenium Filling using Electroplating for 3D Integration
Novel Electrodeposition for Advanced Semiconductors Package
ISMP, International Symposium on Microelectronics and Packaging
The enhancement of copper to copper direct bonding process using Current-induced bonding method.
2022년도 대한금속？재료학회 추계학술대회
Synthesis of Nickel/Palladium/Nickel (Ni/Pd/Ni) nanowire for hydrogen leak sensor
Cu to Cu direct bonding with optimized self-annealing behavior of the electroplated copper