발행물

전체 논문

58

11

Characteristics of Copper Nitride Nanolayer Used in 3D Cu Bonding Interconnects
H. Park, H. Seo, S. E. Kim
Electronic Materials Letters, 2021

12

Low-Temperature (260°C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration
H. Park, H. Seo, Y. Kim, S. Park, S. E. Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021

13

Effect of Ag Nanolayer in Low Temperature Cu/Ag-Ag/Cu Bonding
Y. Kim, S. Park, S. E. Kim
J. Microelectron. Packag. Soc., 2021

14

Effects of Ar/N2 Two-step Plasma Treatment on the Quantitative Interfacial Adhesion Energy of Low-Temperature Cu-Cu Bonding Interface
S. Choi, G. Kim, H. Seo, S. E. Kim, Y. Park
Scientific Reports, 2020

15

Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper-copper bonding
H. Park, H. Seo, S. E. Kim
IEEE Transactions on Components, Packaging and Manufacturing, 2020

16

Comprelensive analysis of a Cu nitride passivated surface that enhances Cu-to-cu bonding
H. Seo, H. Park, S. E. Kim
IEEE Transactions on Components, Packaging and Manufacturing, 2020

17

Two-step plasma treatment on copper surface for low temperature Cu thermo-compression bonding
H. Park, S. E. Kim
Proc. IEEE ECTC, 2020

18

Effects of two-step plasma treatment on Cu and SiO2 surfaces for 3D bonding applications
H. Seo, H. Park, G. Jim, Y. B. Park, S. E. Kim
Proc. IEEE ECTC, 2020

19

Development of CMOS-compatible low temperature Cu bonding optimized by the response surface methodology
H. Park, H. Seo, M. Park, S. E. Kim
J. Microelectron. & Packag. Soc., 2020

20

Cu-SiO2 hybrid bonding
H. Seo, H. Park, S. E. Kim
J. Microelectron. & Packag. Soc., 2020