발행물

전체 논문

58

51

Study of On-chip Liquid Cooling in Relation to Micro-channel Design
Y. Won, S. Kim, S. E. Kim
J. Microelectron. & Packag. Soc., 2015

52

Study of Chip-level Liquid Cooling for High-heat-flux Devices
M. Park, S. Kim, S. E. Kim
Microelectron. Eng., 2015

53

Wafer level Cu-Cu direct bonding for 3D integration
S. E. Kim, S. Kim
Microelectron. Reliab., 2014

54

Characterization of flip chip bonded structure with Cu ABL power bumps
J. Ma, S. Kim, S. E. Kim
ECS Solid State Letters, 2014

55

Homo-junction pn diode using p-type SnO and n-type SnO thin films
J. Um, S. E. Kim
J. Microelectron. & Packag. Soc., 2014

56

Bumpless interconnect system for fine-pitch devices
S. E. Kim
J. Microelectron. & Packag. Soc., 2014

57

Study of micro flip chip process using ABL bumps
J. Ma, S. Kim, S. E. Kim
Microelectronic Eng., 2014

58

The Effects of Cu TSV on the Thermal Conduction in 3D Stacked IC