발행물

전체 논문

58

31

Structural Characteristics of Ar-N2 Plasma Treatment on Cu Surface
H. Park, S. E. Kim
J. Microelectron. & Packag. Soc., 2018

32

Study of Organic-inorganic Hybrid Dielectric for the use of Redistribution Layers in Fan-out Wafer Level Packaging
C. Song, S. E. Kim
J. Microelectron. & Packag. Soc., 2018

33

Effect of Si grinding on electrical properties of sputtered tin oxide thin films
S. Cho, S. E. Kim
J. Microelectron. & Packag. Soc., 2018

34

Organic-inorganic Hybrid Dielectric with UV Patterning and UV Curing for Global Interconnect Applications
C. Song, H. Park, H. Seo, S. E. Kim
ECS Journal of Solid State Science and Technology, 2017

35

Comparative Analysis of SnOx Thin Films Deposited by RF Reactive Sputtering with Different SnO/Sn Target Compositions
C. Kim, S. Kim, S. E. Kim
J. Microelectron. & Packag. Soc., 2017

36

Ox Thin Films Deposited by RF Reactive Sputtering with Different SnO/Sn Target Compositions
C. Kim, S. Kim, S. E. Kim
J. Microelectron. & Packag. Soc., 2017

37

On-chip Decoupling Capacitor for Power Integrity
S. Cho, S. E. Kim
J. Microelectron. & Packag. Soc., 2017

38

Effect of coolants and metal bumps on the heat removal of liquid cooled microchannel system
Y. Won, S. Kim, S. E. Kim
J. Microelectron. & Packag. Soc., 2017

39

Study of the effect of vacuum annealing on sputtered SnxOy thin films by SnO/Sn composite target
C. Kim, S. Cho, S. Kim, S. E. Kim
Thin Solid Films, 2017

40

Transparent SnOx thin films fabricated by rf reactive sputtering with SnO/Sn composite target
C. Kim, S. Kim, S. E. Kim
Microsyst. Technol, 2017