Bonding strength evaluation of copper bonding using copper nitride layer

Nitrogen passivation formation on Cu surface by Ar–N2 plasma for Cu-to-Cu wafer stacking application

Two-step plasma treatment on sputtered and electroplated Cu surfaces for Cu-to-Cu bonding application

a treatment on sputtered and electroplated Cu surfaces for Cu-to-Cu bonding application

Process and characterization of photo-definable organic-inorganic dielectric for wafer level packaging

Analysis of Ar Plasma Effects for Copper Nitride Passivation Formation via Design of Experiment

Nitrogen passivation formation on Cu surface by Ar-N2 plasma for Cu-to-Cu wafer stacking application

Assessment of spin-on-glass for fan-out wafer level packaging with multilayer interconnects

Fabrication of tin oxide thin film transistors by RF magnetron sputtering using Sn/SnO composite target

Fabrication and characteristics of spin-on dielectric for multi-level interconnect in WLP