발행물

전체 논문

58

41

Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application
M. Park, S. Kim, S. E. Kim
Kor. J. Mater. Res., 2016

42

Analysis of sputter-deposited SnO thin film with SnO/Sn composite target
C. Kim, S. Kim, S. E. Kim
Japanese J. Applied Physics, 2016

43

Experimental assessment of on-chip liquid cooling through micro-channel with DI water and diluted ethylene glycol
Y. Won, S. Kim, S. E. Kim
J. Microelectron. & Packag. Soc., 2016

44

Heterogeneous Device Packaging Technology for the Internet of Things Applications
S. E. Kim
Japanese J. Applied Physics, 2016

45

Effects of forming gas plasma treatment on low-temperature Cu–Cu direct
S. Kim, Y. Nam, S. E. Kim
J. Nanoparticle Research, 2016

46

Exploring the intellectual structure of nanoscience and nanotechnology: journal citation network analysis
H. Jo, Y. Park, S. E. Kim, H. Lee
Microelectronic Eng., 2016

47

Thermal Assessment of Copper Through Silicon Via in 3D IC
Y. Shin, S. E. Kim, S. Kim
J. Microelectron. & Packag. Soc., 2016

48

IC Thermal Management Using Microchannel Liquid Cooling Structure with Various Metal Bumps
Y. Won, S. Kim, S. E. Kim
Appl. Sur. Sci., 2015

49

Cooling Structure with Various Metal Bumps
Y. Won, S. Kim, S. E. Kim
Appl. Sur. Sci., 2015

50

Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics
M. Park, S. Back, S. Kim, S. E. Kim
J. Microelectron. & Packag. Soc., 2015