Effect of Dissolved Oxygen on Removal of Benzotriazole from Co During a Post-Co CMP Cleaning

Formulation and Evaluation of Diluted Sulfuric-Peroxide-HF (DSP+) Mixtures for Cleaning High-Aspect Ratio Contacts in 3D NAND

Contamination Mechanism of Ceria Particles on the Oxide Surface after the CMP Process

Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process

Characterization of Different Cobalt Surfaces and Interactions with Benzotriazole for CMP Application

Nanocatalyst-induced hydroxyl radical ((OH)-O-center dot) slurry for tungsten CMP for next-generation semiconductor processing

Investigation of particle agglomeration with in-situ generation of oxygen bubble during the tungsten chemical mechanical polishing (CMP) process

Ultrasound-induced break-in method for an incoming polyvinyl acetal (PVA) brush used during post-CMP cleaning process

Study on possible root causes of contamination from an incoming PVA brush during post-CMP cleaning

Post-CMP Cleaning of InGaAs Surface for the Removal of Nanoparticle Contaminants for Sub-10nm Device Applications