Suppression of thermal deformation of machine tool spindle using TiC-Fe composite

Surface measurement of silicon wafer using harmonic phase-iterative analysis and wavelength-scanning Fizeau interferometer

Wavelength-tuning interferometry with suppression of dispersive error

Wavelength-tuning multiple-surface interferometric analysis with compression of Zernike piston phase error

Suppression of machine tool spindle vibration using TiC-SKH51 metal-matrix composite

Precise interferometric surface profiling of silicon wafer using sampling window and wavelength tuning

Phase extraction formula for glass thickness measurement using Fizeau interferometer

Wavelength-modulation Fourier interferometry with elimination of DC phase error

Application of support vector regression and genetic algorithm to reduce web warping in flexible roll-forming process

Interferometric thickness measurement of glass plate by phase modulation analysis using wavelength scanning with elimination of bias phase error