발행물

전체 논문

321

211

Symmetric AFM cantilever for mechanical characterization of Mo thin film
LEE, HJ, KIM, JH, CHO, K, KANG, JY, BAEK, CW, KIM, JM, 좌성훈
INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 200610

212

Experimental studies of through-wafer copper interconnect in wafer level MEMS packaging
좌성훈
Key Engineering Materials, 200609

213

Thermo-mechanical behavior of MEMS gyroscope sensor package subjected to temperature change
JOO J.-W., CHO Y.C., WON J., 0, 좌성훈
Key Engineering Materials, 200609

214

Reliability of hermetic RF MEMS wafer level packaging using Au-Sn eutectic bonding
WANG Q., KIM W., HWANG J., HAM S., MOON C., 좌성훈
Key Engineering Materials, 200609

215

Effects of packaging induced stress on MEMS devices and its improvements
LEE M.C., CHO Y.C., 좌성훈
Key Engineering Materials, 200609

216

Direct CTE measurement technique for the MEMS materials
OH C.-S., LEE C.-S., LEE H.-J., 좌성훈
Key Engineering Materials, 200609

217

Thermal transport properties of various thin films for MEMS applications
CHOI S.R., KIM D., 좌성훈
Key Engineering Materials, 200609

218

Size effect on tensile strength of surface-micromachined Al-3%Ti thin films
PARK J.-H., CHE W.-S., MYUNG M.S., KIM Y.-J., LEE C.S., 좌성훈
Key Engineering Materials, 200609

219

Thermal diffusivity of metallic thin films: Au, Sn, Mo, and Al/Ti alloy
CHOI, SR, KIM, D, 좌성훈
INTERNATIONAL JOURNAL OF THERMOPHYSICS, 200609

220

Package-level integrated antennas based on LTCC technology
WI, SH, SUN, YB, SONG, IS, KOH, IS, LEE, YS, YOOK, JG, 좌성훈
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 200608