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231

패키징으로 인한 응력이 MEMS 소자에 미치는 영향 분석 및 개선
좌성훈, 0, 0
한국정밀공학회지, 200511

232

Reliability of MEMS packaging: vacuum maintenance and packaging induced stress
좌성훈
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 200510

233

New Structures and Techniques For Easy Axial Loading Test and Static and Fatigue Properties of MEMS Materials
좌성훈
Key Engineering Materials - 직접입력, 200509

234

ISDG를 이용한 박막의 인장시험 장치 개발 및 물성 평가
좌성훈
한국정밀공학회지, 200509

235

Au-Sn 공정 접합을 이용한 RF MEMS 소자의 Hermetic 웨이퍼 레벨 패키징
좌성훈
마이크로전자 및 패키징 학회지, 200506

236

Reliability of Vacuum Packaged MEMS Gyroscope
좌성훈
microelectronics reliability - 직접입력, 200503

237

Reliability of vacuum packaged MEMS gyroscopes
좌성훈
MICROELECTRONICS RELIABILITY, 200502

238

Experimental reliability estimation and improvement for a wafer level vacuum packaged MEMS device
CHOI, MS, 좌성훈
ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, 200501

239

New structures and techniques for easy axial loading test of static and fatigue properties of MEMS materials
PARK, JH, KIM, CY, LEE, CS, CHE, WS, SONG, JH, 좌성훈
ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, 200501

240

Force-calibrated AFM for mechanical test of freestanding thin films
LEE, HJ, CHO, KH, KIM, JH, HAN, SW, CHOI, BI, BAEK, CW, KIM, JM, 좌성훈
ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, 200501