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321

221

Mechanical Properties of Au Thin Film for Application in MEMS/NEMS using Micro tensile Test
좌성훈
Current Applied Physics - 등재후보, 200608

222

SiOG 공정을 이용한 고 신뢰성 MEMS 자이로스코프
좌성훈, 0, 0, 0, 0
마이크로전자 및 패키징 학회지, 200606

223

Thermal conductivity of AlN and SiC thin films
CHOI, SR, KIM, D, LEE, SH, KIM, JK, 좌성훈
INTERNATIONAL JOURNAL OF THERMOPHYSICS, 200605

224

Mechanical properties of Al-3%Ti thin film for reliability analysis of RF MEMS switch
PARK, JH, KIM, YJ, 좌성훈
FRACTURE AND STRENGTH OF SOLIDS VI, PTS 1 AND 2, 200604

225

Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging
WANG Q., KIM W., HWANG J., HAM S., MOON C., 좌성훈
Journal of Electronic Materials, 200603

226

Bubble dynamics induced by pulsed-laser evaporation of ink as a method to develop novel print heads
JANG, D, HONG, J, KIM, D, 좌성훈
JOURNAL OF IMAGING SCIENCE AND TECHNOLOGY, 200603

227

Highly miniaturized RF bandpass filter based on thin-film bulk acoustic-wave resonator for 5-GHz-band application
KIM, YD, SUNWOO, KH, SUL, SC, LEE, JH, KIM, DH, SONG, IS, YOOK, JG, 좌성훈
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 200603

228

Bubble Dynamcis Induced by Pulsed-Laser Evaporation of Ink as a Method to Devolpe Novel Print Heads
좌성훈
Journal of Imaging Science and Technology - 직접입력, 200603

229

Novel test procedure of tensile test for MEMS materials
PARK, JH, KIM, YJ, MYUNG, MS, LEE, CS, CHOI, NS, 좌성훈
ADVANCED NONDESTRUCTIVE EVALUATION I, PTS 1 AND 2, PROCEEDINGS, 200601

230

A high yield rate MEMS gyroscope with a packaged SiOG process
LEE, MC, KANG, SJ, JUNG, KD, CHO, YC, 좌성훈
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 200511