발행물
컨퍼런스
IEEE 5th Electronics Packaging Technology Conference
,
Overview of Power/Ground Effect on Data Eye and Clock Jitter; from Board Resonance to Substrate Coupling
Accurate Measurement of Power/Ground Impedance with Embedded Film Capacitor using Two-port Self-Impedance Measurement Technique
5th IEEE Electronics Packaging Technology Conference
Analytical Model of Power/Ground Noise Coupling to Signal Traces in High-speed Multi-Layer Packages or Boards
IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging
Significant Reduction of Power/Ground Inductive Impedance and Simultaneous Switching Noise by Using Embedded Film Capacitor
Prediction and Verification of Power/Ground Plane Edge Radiation Excited by Through-Hole Signal Via Based on Balanced TLM and Via Coupling Model