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컨퍼런스
IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging
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3 GHz Wide Frequency Model of Ferrite Bead for Power/Ground Noise Simulation of High-speed PCB
Tapered Slot Shape on Slotted Reference Plane of Multi-layer PCB for Reduction of Crosstalk and Radiated Emission
A Novel Twisted Differential Line on PCB: Crosstalk Model and Its Application to High-speed Interconnect Circuit Design
EMC Europe 2002 International Symposium on Electromagnetic Compatibility
Design Comparison of I/O Port Ground and Power Plane for Enhanced ESD Immunity
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging
Unit cell modeling of meander delay line based on finite-difference time-domain method and Floquet`s theorem