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53rd Electronic Components and Technology Conference 2003
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Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages
53rd Electronic Components and Technology Conference, 2003
Effect of decoupling capacitor on signal integrity in applications with reference plane change
Electronic Components and Technology Conference
3GHz Through-Hole Signal Via Model Considering PowedGround Plane Resonance Coupling and Via Neck Effect
2003 Asia-Pacific Microwave Conference
Analysis of Power/Ground Network for Mixed Mode Circuits in Multi-layer PCB
IEEE 7th Workshop on Signal Propagation on Interconnects
10 GHz Differential Line Modeling of Leadframe-type TQFP Package for High-speed Serial Interconnection Systems