발행물
컨퍼런스
2003 Asia-Pacific Microwave Conference
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Reduction of multilayer PCB edge radiation excited by through-hole signal via with De-Cap Fence
IEEE 4th Electronics Packaging Technology Conference
Effects of Process Variation on Signal Integrity for High Speed Differential Signaling on Package Level
Investigation of Plane-to-Plane Noise Coupling through Cutout in Multi-layer Power/Ground Planes
Over GHz Frequency Model of Commercial 2mm Hard Metric Connector using On-board Calibration Standards
IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging
An Efficient Hybrid Transmission Line Method (HTLM) for Analysis of Perforated Package Power/Ground Plane