,

Analysis of Via Distribution Effect on Multi-layered Power/Ground Transfer Impedance of High-performance Packages

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Radiated emission from Plasma Display Panel (PDP) depending on addressing line structure and current driving scheme

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Dithered timing spread spectrum clock generation for reduction of electromagnetic radiated emission from high-speed digital system

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Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board

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Experimental investigation of radiated emission from flexible printed circuit (FPC) cable