발행물
컨퍼런스
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging
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Picosecond-pulse propagation measurement on microstrip meander lines using a novel optical near-field mapping probe
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2001
Equivalent circuit representation and dimension reduction technique for efficient FDTD modeling of power/ground plane
Microwave frequency crosstalk model of redistribution line patterns on wafer level package
2001 International Symposium on Electromagnetic Compatibility
Separated role of on-chip and on-PCB decoupling capacitors for reduction of radiated emission on printed circuit board
2001 IEEE International Symposium on Electromagnetic Compatibility
Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board