발행물
컨퍼런스
2001 International Symposium on Electromagnetic Compatibility
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Controlled power/ground noise on multi-layer digital printed circuit board using adaptive CMOS output driving scheme
Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition
Effect of power/ground partitioning and stitching capacitor placement on signal integrity and emi of multi-layer and multi power system
Advances in Electronic Packaging
An undergraduate class for high-frequency design, fabrication, and measurement
51st Electronic Components and Technology Conference
Microwave frequency model of water level package and increased loading effect on rambus memory module
Over GHz low-power RF clock distribution for a multiprocessor digital system