발행물
컨퍼런스
6th IEEE Workshop on Signal Propagation on Interconnects, SPI
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Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board
Design guidelines of spread spectrum clock for suppression of radiation and interference from high-speed interconnection line
Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method
IEEE 4th Electronics Packaging Technology Conference
A Novel Twisted Differential Line for High-speed On-chip Interconnections with Reduced Crosstalk
IEEE 6th Workshop on Signal Propagation on Interconnects
Unit Cell Modeling of Interconnect Isolated by Metal-filled Via Array for High Crosstalk Immunity