발행물

전체 논문

280

241

The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging
김근수, 김종민, K. Suganuma, 황치원
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 200406

242

Dynamic modeling for resin self-alignment mechanism
김종민, 신영의, K. Fujimoto
MICROELECTRONICS RELIABILITY, 200406

243

New process of self-organized interconnection in packaging using conductive adhesive with low melting point filler
K. Yasuda, K. Fujimoto, M. Yasuda, 김종민
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 200404

244

Formation of a self-interconnected joint using a low-melting-point alloy adhesive
K. Yasuda, 김종민, M. Yasuda, K. Fujimoto
MATERIALS TRANSACTIONS, 200403

245

The effect of reduction capability of resin material on the solder wettability for electrically conductive adhesives (ECAs) assembly
김종민, K. Yasuda, M. Yasuda, K. Fujimoto
MATERIALS TRANSACTIONS, 200403

246

New electrically conductive adhesives filled with low-melting-point alloy fillers
김종민, K. Yasuda, M. Rito, K. Fujimoto
MATERIALS TRANSACTIONS, 200401

247

Parametric Design for Resin Self-Alignment Capability
김종민, K. Fujimoto
IEICE TRANSACTIONS ON ELECTRONICS, 200310

248

Improvement of Board Level Reliability for ？？BGA Solder Joints Using Underfill
김종민, 신영의, D. F. Farson
MATERIALS TRANSACTIONS, 200310

249

Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill
김종민
MATERIALS TRANSACTIONS - 직접입력, 200310

250

Self-alignment behavior using liquid surface tension
T. Yamada, 김종민, K. Yasuda, K. Fujimoto
Preprints of the National Meeting of J.W.S., 200310