발행물

전체 논문

280

251

Adhesive Joining Process and Joint Property with Low Melting Point Filler
K. Yasuda, 김종민, K. Fujimoto
3rd Int. IEEE Conf. on Polymer and Adhesives in Microelectronics and Photonics, 200310

252

Resin Self-Alignment Processes for Assembly of Microelectronic and Optoelectronic Devices
김종민, K. Yasuda, K. Fujimoto
3rd Int. IEEE Conf. on Polymer and Adhesives in Microelectronics and Photonics, 200310

253

New Process of Self-Organized Interconnection in Packaging by Conductive Adhesive with Low Melting Point Filler
K. Yasuda, 김종민, M. Yasuda, K. Fujimoto
Int. Conf. Solid State Devices and Materials, 200309

254

언더필이 적용된 μBGA 솔더 접합부의 열피로특성
고영욱, 김종민, J. H. Lee, 신영의
대한용접학회지, 200308

255

Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability
김종민, 신영의, K. Fujimoto
MATERIALS SCIENCE FORUM, 200306

256

Prediction of Thermal Fatigue Life on ？？BGA Solder Jonit Using Sn-3.5Ag, Sn-3.5Ag-0.7Cu and Sn-3.5Ag-3.0In-0.5Bi Solder Alloys
김연성, 김종민, 신영의, 김형일
대한용접학회지, 200306

257

Sn-3.5Ag, Sn-3.5Ag-0.7Cu and Sn-3.5Ag-3.0In-0.5Bi Solder를 이용한 μBGA Solder접합부의 열피로 수명예측
김종민
대한용접학회지, 200306

258

Joining Mechanism and Joint Property by Polymer Adhesive with Low Melting Alloy Filler
K. Yasuda, 김종민, M. Yasuda, K. Fujimoto
2003 International conference on Electronics Packaging, 200304

259

Novel Passive Self-Alignment Process Using Liquid Resin Material and Alignment Motion
김종민, K. Fujimoto
2003 International Conference on Electronics Packaging, 200304

260

Study on System Integration
R. Sato, K. Funimoto, 김종민, K. Yasuda, Y. Iwata
1st Sym. Center of Excellence for Advanced Structural and Functional Material Design (ASFMD), 200303