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논문
특허
저서
컨퍼런스

전체 논문

174

151

Mathematical Model-Based Evaluation Methodology for Environmental Burden of Chemical Mechanical Planarization Process
Lee, H, Dornfeld, DA, Jeong, H
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY, 2014

152

Effect of Heat According to Wafer Size on the Removal Rate and Profile in CMP Process
Yeongbong Park, 이영균, 이현섭, 정해도
Electronic Materials Letters, 2013

153

Effect of wafer size on material removal rate and its distribution in chemical mechanical polishing of silicon dioxide film
Lee, H, Park, Y, Lee, S, Jeong, H
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2013

154

Effect of Contact Angle between Retaining Ring and Polishing Pad on Material Removal Uniformity in CMP Process
Park, Y, Lee, H, Lee, Y, Park, S, Jeong, H
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2013

155

Evaluation of environmental impacts during chemical mechanical polishing (CMP) for sustainable manufacturing
Lee, H, Park, S, Jeong, H
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2013

156

Effect of Pad Groove Geometry on Material Removal Characteristics in Chemical Mechanical Polishing
Guo, Y, Lee, H, Lee, Y, Jeong, H
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2012

157

Temperature Distribution in Polishing Pad during CMP Process: Effect of Retaining Ring
Lee, H (Lee, Hyunseop), Guo, Y (Guo, Yongchang), Jeong, H (Jeong, Haedo)
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2012

158

Chemical Mechanical Planarization of Copper Bumps on Printed Circuit Board
Jeong, M, Jo, S, Lee, H, Lee, A, Kang, C, Choi, J, Kim, J, Jeong, H
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2011

159

구리 CMP 후 버핑 공정을 이용한 연마 입자 제거
정해도, 신운기, 박선준, 이현섭, 정문기, 이영균, 이호준, 김영민, 조한철, 주석배
전기전자재료학회논문지, 2011

160

Chemical Mechanical Polishing of a Ti-Si-N Nanocomposite and AFM Study on Its Nanostructure
Lee, H, Kim, DI, Jeong, H, Kim, KH
JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2010