발행물
컨퍼런스
제21회 한국반도체학술대회
,
Distribution of Plasma Parameters at Wafer Level Measured by 2D Plasma Parameter Diagnostic Method in Inductively Coupled Plasmas
In-Situ Measurement Method of Dielectric-Film Thickness for Processing
A Study on the Enlargement of the Plasma Reactor using a Global Model
International Conference on Surface Engineering 2013
A comparative study on the floating harmonic method using dual frequency in an inductive discharge
Thermo-Compression Flipchip Interconnection using Plasma Enhanced Copper Organic Solderability Preservative Etched Substrate