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2024 International Symposium on Semiconductor Devices and Materials
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ALE Using Organic Gas for Formation of Co Fine Lines
The 12th International Vacuum and Surface Sciences Conference of Asia and Australia
Slanted Etching of Copper Thin Films Using High Density Plasma of Hydrocarbon/Alcohol/Ar gas mixture
Redeposition-Free Copper Etching Using Organic Gas Mixtures”
Formation of Co Fine Lines by Cyclic Etching Using Organic Gas/O2 Mixture
The 12th Vacuum and Surface Science Conference of Asia and Australia
High Density Plasma Reactive Ion Etching of Cobalt Thin Films Using Acetylacetone/Ar Gas mixture