발행물
컨퍼런스
245th Electrochemical society meeting
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Effect of thickness and sidewall slope of photoresist mask on etch profile of copper interconnect
Etch characteristics of cobalt thin films in high density plasma of Cl2/O2/Ar gas mixture
The 31th Korean Conference on Semiconductors
Correlation between mask slope and redeposition in Cu dry etching
Nanometer-Scale Etching of Cobalt Thin Films Using High Density Plasma of Acetone/Ar
Korean International Semiconductor Conference on Manufacturing Technology 2023
Effect of mask thickness on redeposition in etch profile of Cu dry etching