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Influence of Additive Gases to Organic Chelators on Etch Characteristics of Copper Thin Films Using Inductively Coupled Plasma Reactive Ion Etching

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Nanometer-scale etching of copper thin films using inductively coupled plasma of organic chemicals and alcohols

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Influence of pulsed-modulated RF source plasma on etch characteristic of nanoscale patterned copper thin film using CH3COOH/Ar

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Controlled Layer-by-Layer Etching of Copper Thin Films

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Inductively Coupled Plasma Reactive Ion Etching of Copper Thin Film using Organic Chemicals and Alcohols