발행물
컨퍼런스
The 65th American Vacuum Society
,
Etch Characteristics of Nanometer-scale Patterned Cu Thin Film Using Pulse modulated RF Source Plasma
Inductively Coupled Plasma Reactive Ion Etching of Nanometer-scale Patterned Copper Thin Films using Alcohol-based Gases
The 7th International Conference on Microelectronics and Plasma Technology
Etch characteristics of nanoscale patterned magnetic tunnel junction stacks using pulse-modulated RF source plasma
Dry etching of copper thin films in high density plasma of organic acids
Effect of Non-Corrosive Gas Mixture on Etching of Cu Thin Film Using Inductively Coupled Plasma Reactive Ion Etching