A study on the optimal shape prediction of μ****BGA solder joint
Y. E. Shin, S. H. Ji, K. Fujimoto, J. M. Kim
IMAPS-KOREA J. of the Micro-electronics & Packaging Society, 2001.09
12
Characteristic of intermetallic compounds for aging of lead free solders applied to 48 μ****BGA
Y. E. Shin, S. Lee, K. Fujimoto, J. M. Kim
IMAPS-KOREA J. of the Micro- electronics & Packaging Society in Korea, 2001.09
13
The application of electropolishing for removing burrs and residual stress of stamping leadframe
Y. E. Shin, H. H. Kim, K. S. Kim, K. Fujimoto, J. M. Kim
IMAPS-KOREA J. of the Microelectronics & Packaging Society, 2001.09
14
A Study on the life prediction and quality improvement of joint in IC package
Y. E. Shin, J. M. Kim
J. of KWS, 1999.02
15
Design optimization of hybrid actuation combining macro-mini actuators
Nam-Ho Kim, Jong-Min Kim, Oussama Khatib and Dongjun Shin
International Journal of Precision Engineering and Manufacturing, 2017
16
Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs)
Byung-Seung Yim, Young-Eui Shin and Jong-Min Kim
Microelectronics Reliability, 2018
17
Influence of reductant concentration on the conduction path formation properties of solderable polymer composites
Byung-Seung Yim, Jeong Il Lee and Jong-Min Kim
Materials Transactions, 2018
18
BGA interconnection properties of solderable polymer composites with low-melting-point alloy fillers
Byung-Seung Yim, Young-Eui Shin and Jong-Min Kim
Journal of Electronic Packaging, 2017
19
Generation and stability of bulk nanobubbles
Seung Hoon Oh and Jong-Min Kim
LANGMUIR, 2017
20
Effect of multi-walled carbon nanotube (MWCNT) concentration on thermomechanical reliability of MWCNT-reinforced solderable isotropic polymer nanocomposites
Byung-Seung Yim and Jong-Min Kim
Journal of Materials Science: Materials in Electronics, 2016