발행물

전체 논문

280

81

New process of self-organized interconnection in packaging using conductive adhesive with low melting point filler
Kiyokazu Yasuda, Jong-Min Kim, Masahiro Yasuda and Kozo Fujimoto
Japanese Journal of Applied Physics, 2004.04

82

Formation of a self-interconnected joint using a low-melting-point alloy adhesive
Kiyokazu Yasuda, Jong-Min Kim, Masahiro Yasuda and Kozo Fujimoto
Materials Transactions, 2004.03

83

The effect of reduction capability of resin material on the solder wettability for electrically conductive adhesives (ECAs) Assembly
Jong-Min Kim, Kiyokazu Yasuda, Masahiro Yasuda and Kozo Fujimoto
Materials Transactions, 2004.03

84

New electrically conductive adhesives filled with low melting point alloy fillers
Jong-Min Kim, Kiyokazu Yasuda, Masahiro Rito and Kozo Fujimoto
Materials Transactions, 2004

85

Parametric design for resin self-alignment capability
Jong-Min Kim and Kozo Fujimoto
IEICE Transaction on Electronics, 2003.10

86

Improvement of board level reliability for μBGA solder joints using underfill
Jong-Min Kim, D. F. Farson and Young-Eui Shin
Materials Transactions, 2003.10

87

Effect of viscosity of liquid resin on resin self-alignment capability
Jong-Min Kim, Young-Eui Shin and Kozo Fujimoto
Materials Science Forum, 2003.06

88

Highly precise positioning method by pull-up model self-alignment process using liquid surface tension
Jong-Min Kim, Kiyokazu Yasuda, Kozo Fujimoto and Shuji Nakata
Quarterly Journal of the JWS, 2002.08

89

3-D highly precise self-alignment process using surface tension of liquid resin material
Jong-Min Kim, Kiyokazu Yasuda, Young-Eui Shin and Kozo Fujimoto
IEICE Transaction on Electronics, 2002.07

90

Self-alignment process using liquid resin for assembly of electronic or optoelectronic devices
Kozo Fujimoto, Jong-Min Kim and Shuji Nakata
IEICE Transaction on Electronics, 2001.12