발행물

전체 논문

280

71

The influences of residual stress on the frequency of ultrasonic transducers with composite membrane structure
Seungmock Lee, Jong-Min Kim and Young-Eui Shin
Journal of Mechanical Science and Technology, 2006

72

Selection of proper fatigue model for flip chip package reliability
Young-Eui Shin, Yeon Sung Kim, Hyoung-Il Kim, Jong-Min Kim, Kyong Ho Chang and Dave F. Farson
Materials Science Forum, 2005.12

73

Novel interconnection method using electrically conductive paste with fusible filler
Jong-Min Kim, Kiyokazu Yasuda and Kozo Fujimoto
Journal of Electronic Materials, 2005.05

74

Stress influences on the ultrasonic transducers
Seungmock Lee, Tsunehisa Tanaka, Koji Inoue, Jong-Min Kim, Young-Eui Shin and Masanori Okuyama
Sensors and Actuators, A; Physical, 2005.04

75

Adhesive joining process and joint property with low melting point filler
Kiyokazu Yasuda, Jong-Min Kim and Kozo Fujimoto
Journal of Electronic Packaging, 2005.03

76

Resin self-alignment processes for self-assembly systems
Jong-Min Kim, Kiyokazu Yasuda and Kozo Fujimoto
Journal of Electronic Packaging, 2005.03

77

The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces
K. S. Kim, K. W. Ryu, C. H. Yu and Jong-Min Kim
Microelectronics Reliability, 2005.04

78

Isotropic conductive adhesives with fusible filler particles
Jong-Min Kim, Kiyokazu Yasuda and Kozo Fujimoto
Journal of Electronic Materials, 2004.11

79

The observation and simulation of Sn-Ag-Cu solidification in chip-scale packaging
Keun-Soo Kim, Katsuaki Suganuma, Jong-Min Kim and Chi-Won Hwang
JOM, 2004.06

80

Dynamic modeling for resin self-alignment mechanism
Jong-Min Kim, Young-Eui Shin and Kozo Fujimoto
Microelectronics Reliability, 2004.06