발행물

전체 논문

280

91

Investigation of bonding properties of solderable anisotropic polymer composite filled with low- and high?melting?point alloy fillers
김종민, 임병승, 하이현, 이정일
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202411

92

Mechanical Properties of Sn58Bi?Cu Composite Solder Filled with Copper Particles
김종민, 임병승, 정명진, 이정일
MATERIALS TRANSACTIONS, 202410

93

저융점/고융점 혼합 솔더 필러 함유 Solderable 이방성 고분자 복합 재료의 기계적 접합 특성
김종민, 임병승, 하이현, 정명진, 박종문, 최성우
대한용접접합학회지, 202404

94

Investigation of interconnection properties of solderable isotropic polymer composite filled with low? and high?melting?point solder mixed fillers
김종민, 하이현, 이정일, 임병승
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202309

95

An investigation of the bonding properties of Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs)
김종민, 윤희준, 이정일, 하이현, 임병승
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202304

96

Mechanisms for the formation of conduction paths in a solderable epoxy composite with a mixed low- and high-melting-point solder filler
김종민, 하이현, 이정일, 임병승
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202304

97

Mechanical Properties of Solderable Polymer Composites with Low- and High- Melting-Point Solder Mixed Filler
하이현, 이정일, 임병승, 김종민, 김상일, 조원철
MATERIALS TRANSACTIONS, 202304

98

Proliferative effects of nanobubbles on fibroblasts
김종민, 허한솔, 이정일, 김정호, 박중열, 박준선
BIOMEDICAL ENGINEERING LETTERS, 202211

99

Influence of temperature on bulk nanobubble generation by ultrasonication
이정일, 김종민
COLLOID AND INTERFACE SCIENCE COMMUNICATIONS, 202207

100

Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
하민정, 김종민, 임병승, 김지호, 한재구, 양진석
대한용접접합학회지, 202206