Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy filler
Jeong Il Lee, Byung-Seung Yim, Dongjun Shin and Jong-Min Kim
Journal of Materials Science: Materials in Electronics, 2016
22
Influence of fuctionalized graphene on the electrical, mechanical, and thermal properties of solderable isotropic conductive adhesives
Byung-Seung Yim, Kiho Kim, Jooheon Kim and Jong-Min Kim
Journal of Materials Science: Materials in Electronics, 2016
23
Thermo-mechanical reliability of a multi-walled carbon nanotube-incorporated solderable isotropic conductive adhesive
Byung-Seung Yim and Jong-Min Kim
Microelectronics Reliability, 2016
24
Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers
Jeong Il Lee, Byung-Seung Yim, Mu Seong Yun and Jong-Min Kim
Journal of Materials Science: Materials in Electronics, 2016
25
Magnetic filler alignment of paramagnetic Fe3O4 coated SiC/epoxy composite for thermal conductivity improvement
Kiho Kim, Mihyun Kim, Jong-Min Kim and Jooheon Kim
Ceramics International, 2015.11
26
Long-term stability of hydrogen nanobubble fuel
Seung Hoon Oh, Jung Guen Han and Jong-Min Kim
Fuel, 2015
27
Bonding characteristics of underfilled ball grid array packaging
Byung-Seung Yim, Jeong Il Lee, Byung Hun Lee, Yong-Eui Shin and Jong-Min Kim
Materials Transactions, 2015
28
Influence of multi-walled carbon nanotube (MWNT) concentration on the interconnection properties of solderable anisotropic conductive adhesives (SACAs)
Byung-Seung Yim and Jong-Min Kim
Journal of Materials Science: Materials in Electronics, 2015
29
Electrical and mechanical properties of multiwalled carbon nanotubes-reinforced solderable polymer nanocomposites
Byung-Seung Yim and Jong-Min Kim
Journal of Materials Science: Materials in Electronics, 2015
30
Effect of dispersion condition of multi-walled carbon nanotube (MWNT) on bonding properties of solderable isotropic conductive adhesives (ICAs)
Byung-Seung Yim, Byung Hun Lee, Jooheon Kim and Jong-Min Kim
Journal of Materials Science: Materials in Electronics, 2014