An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler
Byung-Seung Yim, Jeong Il Lee, Byung Hun Lee, Young-Eui Shin and Jong-Min Kim
Microelectronics Reliability, 2014
32
Development of a new contactless dielectrophoresis system for active particle manipulation using movable liquid electrodes
Hyuk Rok Gwon, Suk Tai Chang, Jung Yeul Jeong, Jong-Min Kim, Chang Kyoung Choi and Seong Hyuk Lee
Electrophoresis, 2014
33
Dynamic behavior of capillary-driven encapsulation flow characteristics for different injection types in flip chip packaging
Hyuk Rok Gwon, Hyung Jun Lee, Jong-Min Kim, Young Eui Shin and Seong Hyuk Lee
Journal of Mechanical Science and Technology, 2014
34
Effect of hydrogen nanobubble addition on combustion characteristics of gasoline engine
Seung Hoon Oh, Seung Hyun Yoon, Hojin Song, Jung Guen Han and Jong-Min Kim
Int. Hydrogen Energy, 2013
35
Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers
Byung-Seung Yim, Seung Hoon Oh, Jin Sik Jeong and Jong-Min Kim
Journal of Composite Materials, 2013
36
Properties investigation on chip-on-film (COF) thermosonic bonding using anisotropic conductive films (ACFs)
Jin Sik Jeong, Byung-Seung Yim, Seung Hoon Oh, Hojin Song, Byung Hun Lee and Jong-Min Kim
Materials Transactions, 2012
37
Reliability properties of solderable conductive adhesives with low-melting-point alloy fillers
Byung-Seung Yim, Jeong Il Lee, Yuseon Heo, Jooheon Kim, Seong Hyuk Lee, Yong-Eui Shin and Jong-Min Kim
Materials Transactions, 2012
38
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
Byung-Seung Yim, Yumi Kwon, Seung Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee and Jong-Min Kim
Microelectronics Reliability, 2012
39
Characteristics of graphene-filled solderable isotropically conductive adhesive (ICA)
Byung-Seung Yim, Seung Hoon Oh, Jiwon Kim, Jooheon Kim and Jong-Min Kim
Materials Transactions, 2012
40
The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs)
Jiwon Kim, Byung-Seung Yim, Jong-Min Kim and Jooheon Kim