Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler
Hyomi Kim, Jong-Min Kim, Jooheon Kim
Microelectronics Reliability, 2010
52
Hybrid interconnection process using solderable ICAs (Isotropic conductive adhesives) with low-melting-point alloy fillers
Byung-Seung Yim, Jong-Min Kim, Sung-Ho Jeon, Seong Hyuk Lee, Jooheon Kim, Jung-Geun Han and Minhaeng Cho
Materials Transactions, 2009.11
53
Investigation of the dynamic reactive wetting of Sn-Ag-Cu solder alloys on Ni(P)/Au coated Cu substrates
Taeyoung Kim, Joonho Lee, Yunkyum Kim, Jong-Min Kim and Zhangfu Yuan
Materials Transactions, 2009.11
54
Effect of surface treatment on the mechanical strength of ultrasonically bonded chip on copper-coated glass for ultra-fine pitch application in microelectronics
Jung-Lae Jo, Jong-Bum Lee, Jong-Gun Lee, Sung-Ho Jeon, Jong-Min Kim, Young-Eui Shin, Jeong-Hoon Moon, Choong-Don Yoo and Seung-Boo Jung
Japanese Journal of Applied Physics, 2009.07
55
Curing kinetics and mechanical properties for siloxane contained ETSO-DDM/BPH epoxy system
Hyomi Kim, Jong-Min Kim, Jung-Geun Han and Jooheon Kim
Polymer(Korea), 2009.07
56
Numerical analysis of coalescence characteristics of low melting point alloy fillers using non-equilibrium phase field model
Jae Hyung Kim, Jung Hee Lee, Jong-Min Kim and Seong Hyuk Lee
Materials Transactions, 2009.07
57
Self-organized interconnection process using solderable ACA (Anisotropic conductive adhesive)
Byung-Seung Yim, Jong-Min Kim, Sung-Ho Jeon, Seong Hyuk Lee, Jooheon Kim, Jung-Geun Han, Yong-Sung Eom and Young-Eui Shin
Materials Transactions, 2009.07
58
Effect of atmospheric-pressure plasma treatment on the joint strength between Au flip chip bumps and Cu-finished Si wafer substrates bonded using ultrasonic energy
Jung-Lae Jo, Ja-Myeong Koo, Jong-Bum Lee, Jong-Gun Lee, Seung-Boo Jung, Sung-Ho Jeon, Jong-Min Kim and Jeong-Hoon Moon
J. Kor. Phys. Soc., 2009.03
59
Characteristics of Sn-2.5Ag flip chip solder joints under thermal shock test conditions
Kyoung Chun Yang, Seong Hyuk Lee, Jong-Min Kim, Young Ki Choi, Dave F. Farson and Young-Eui Shin
Journal of Mechanical Science and Technology, 2009.02
60
Numerical investigation on self-organized interconnection using anisotropic conductive adhesive with low melting point alloy filler
Jin Woon Lee, Seong Hyuk Lee, Jong-Min Kim, Jae Hyung Kim and Jung Hee Lee