Thermal and electrical conductivity of Al(OH)3 covered graphene oxide nanosheet/epoxy composites
Jiwon Kim, Hyungu Im, Jong-Min Kim and Jooheon Kim
Journal of Materials Science, 2012
42
Dynamic filling characteristics of a capillary driven underfill process in flip-chip packaging
Seong Hyuk Lee, Hyung Jun Lee, Jong-Min Kim and Young-Eui Shin
Materials Transactions, 2011
43
Biological temperature sensing of focal contacts
Jen-Yung Chang, Bryan Plunger, Jong-Min Kim and Chang Kyoung Choi
Journal of Heat Transfer, 2011.08
44
Flattening characteristics of Ni20Cr thermal-sprayed coating layers on preheated SCM415 substrates
Dong Hwan Shin, Jae Bin Lee, Jae Lyong Wi, Seungil Park, Namil, Kim, Minhaeng Cho, Jong Min Kim and Seong Hyuk Lee
Materials Transactions, 2011.07
45
Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant
Yumi Kwon, Byung-Seung Yim, Jong-Min Kim and Jooheon Kim
Microelectronics Reliability, 2011
46
Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs)
Yumi Kwon, Byung-Seung Yim, Jong-Min Kim and Jooheon Kim
Microelectronics Reliability, 2011
47
Characteristics of isotropically conductive adhesive (ICA) filled with carbon nanotubes (CNTs) and low-melting-point alloy fillers
Byung-Seung Yim and Jong-Min Kim
Materials Transactions, 2010.12
48
Characteristics of thermosonic anisotropic conductive adhesives (ACFs) flip-chip bonding
Jong-Min Kim, Yong Song, Minhaeng Cho, Seong Hyuk Lee and Young-Eui Shin
Materials Transactions, 2010.10
49
Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder
Ji-Won Baek, Keon-Soo Jang, Yong-Sung Eom, Jong-Tae Moon, Jong-Min Kim and Jae-Do Nam
Microelectronic Engineering, 2010
50
Reliability of fine-pitch flip-chip (COG) bonding with non-conductive film using ultrasonic energy
Jung-Lae Jo, Jong-Bum Lee, Jong-Min Kim, Young-Eui Shin and Seung-Boo Jung