발행물

전체 논문

280

101

Influence of Cu powders on the wettability and mechanical properties of solderable epoxy composites
이정일, 김종민, 윤희준, 임병승
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202203

102

Role of anionic surfactant in the generation of bulk nanobubbles by ultrasonication
김종민, 이정일
COLLOID AND INTERFACE SCIENCE COMMUNICATIONS, 202201

103

Investigation of Bonding Mechanism for Cu-Powder Contained Solderable Epoxy Solder Composite
윤희준, 김상일, 임병승, 김종민
MATERIALS TRANSACTIONS, 202110

104

Coarsening behavior of bulk nanobubbles in water
김종민, 한중근, 이정일, 허한솔, 박중열
SCIENTIFIC REPORTS, 202109

105

Mechanical strength and hydration characteristics of cement mixture with highly concentrated hydrogen nanobubble water
김종민, 한중근, 김원경, 홍기권, 김진, 김영호, 이종영
MATERIALS, 202105

106

Effect of hydrogen nanobubbles on the mechanical strength and watertightness of cement mixtures
한중근, 김원경, 이종영, 김영호, 홍기권, 김종민
MATERIALS, 202104

107

Effect of dissolved?gas concentration on bulk nanobubbles generation using ultrasonication
김종민, 임병승, 이정일
SCIENTIFIC REPORTS, 202011

108

Interconnection Mechanism of Ni-Reinforcement Particle Filled Solderable Polymer Composites with Low-Melting-Point Alloy Filler
이정일, 임병승, 김종민, 윤희준
MATERIALS TRANSACTIONS, 202010

109

탄소 나노튜브 함유량이 Solderable 등방성 및 이방성 도전성 접착제의 접합 특성 변화에 미치는 영향
윤희준, 김종민, 임병승, 이정일
대한용접접합학회지, 202004

110

Conduction Path Formation Mechanism of Solderable Polymer Composites with Low-Melting-Point Alloy/High-Melting-Point Alloy Mixed Filler
김종민, 임병승, 이재우
MATERIALS TRANSACTIONS, 202002