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Dynamic behavior of capillary-driven encapsulation flow characteristics for different injection types in flip chip packaging
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Effect of hydrogen nanobubble addition on combustion characteristics of gasoline engine
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Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers
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Reliability properties of solderable conductive adhesives with low-melting-point alloy fillers
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Properties investigation on chip-on-film(COF) thermosonic bonding using anisotropic conductive films (ACFs)
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Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
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MICROELECTRONICS RELIABILITY, 201206
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Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
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MATERIALS TRANSACTIONS, 201203
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The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives(ACAs)
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Thermal and electrical conductivity of Al(OH)3 covered graphene oxide nanosheet/epoxy composites