Influence of functionalized graphene on the electrical, mechanical, and thermal properties of solderable isotropic conductive adhesives
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201605
122
Thermo-mechanical reliability of a multi-walled carbon nanotube-incorporated solderable isotropic conductive adhesive
MICROELECTRONICS RELIABILITY, 201602
123
Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201601
124
Magnetic filler alignmentofparamagneticFe3O4 coated SiC/epoxy composite forthermalconductivityimprovement
김주헌, 김기호, 김미현, 김종민
CERAMICS INTERNATIONAL, 201511
125
Long-term stability of hydrogen nanobubble fuel
한중근, 오승훈, 김종민
FUEL, 201510
126
Bonding Characteristics of Underfilled Ball Grid Array Packaging
임병승, 이정일, 신영의, 이병훈, 김종민
MATERIALS TRANSACTIONS, 201507
127
Influence of multi-walled carbon nanotube (MWNT) concentration on the interconnection properties of solderable anisotropic conductive adhesives (SACAs)
임병승, 김종민
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201507
128
Electrical and mechanical properties of multiwalled carbon nanotubes-reinforced solderable polymer nanocomposites
김종민, 임병승
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201503
129
An Investigation of the Reliability of Solderable ICA with Low-melting-point alloy (LMPA) Filler
신영의, 임병승, 이정일, 이병훈, 김종민
MICROELECTRONICS RELIABILITY, 201411
130
Effect of dispersion condition of multi-walled carbon nanotube (MWNT) on bonding properties of solderable isotropic conductive adhesives (ICAs)
김주헌, 임병승, 이병훈, 김종민
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201409